AdNaNotek

E-Beam Evaporation System

Electron beam evaporation 【e-beam】is a proven deposition technique for creating dense, high-purity coatings.

Our array of E-beam Evaporation systems caters to a diverse set of requirements. Whether it's a need for LN2 cooling substrates, laser heating for high-temperature processes, substrates with a tilting and rotating capability, or oxygen compatibility, we've got you covered. For more specific information, feel free to reach out to us. We are equipped to meet all your specialized needs.
EBS Mini

Glove Box and E beam

E-Beam Evaporator System

Tilted EBS - 150

E-Beam Evaporator System

Electron Beam Evaporator System

AdNaNoTek's Electron Beam Evaporator (EBE) is designed for large-scale thin-film deposition, delivering exceptional quality and remarkable repeatability. This system comes with the option of either single or dual e-beam sources.

Each e-beam source in our system can hold up to 6 crucibles filled with various target materials. With a dual e-beam source setup, it’s possible to deposit two different materials onto the same substrate simultaneously.

Unlike resistively heated sources, our e-beam source facilitates the deposition of materials with high melting points, expanding the range of applications.

Furthermore, our EBE systems are outfitted with a sample planetary mechanism. This feature rotates and revolves multiple samples around a vertical axis. This unique mechanism ensures precise and simultaneous deposition on multiple substrates, significantly enhancing the uniformity and quality of the thin films deposited.

Additionally, we ensure meticulous control and enhanced stability in our deposition processes through automation, utilizing AdNanoTek's FBBEAR system control software. This advanced software facilitates comprehensive data recording, allows for fine-tuning of parameters with precision, and automates the settings for the deposition process, maintaining the utmost consistency and accuracy.
This approach simplifies the operation of the deposition process, offering a fully automated, user-friendly experience. It ensures consistency in performance, and provides reliable repeatability in experimental outcomes.
The E-beam evaporator is versatile in its applications, capable of depositing a wide array of materials. This includes various metals such as Aluminum (Al), Niobium (Nb), Tantalum (Ta), Nickel (Ni), Molybdenum (Mo), and others. It is also effective for elemental semiconductors like Silicon (Si) and Germanium (Ge), as well as a range of oxides including Hafnium Oxide (HfO2), Scandium Oxide (Sc2O3), Tantalum(V) Oxide (Ta2O5), Aluminum Oxide (Al2O3), Silicon Dioxide (SiO2), among others. Moreover, it can be used for the deposition of multiple alloys, showcasing its broad utility in material deposition.

Achievement

AdNanoTek's Dual E-beam Evaporator has successfully fabricated a 4-inch Titanium (Ti) thin film, achieving an impressive degree of homogeneity. The uniformity of the deposited film is remarkably consistent, with a variation of only ±1.7%.
AdNanoTek's E-beam system is outfitted with a substrate planetary manipulator, which is designed to revolve and rotate multiple samples. This feature ensures uniform coverage and consistent deposition across all samples.
The inclusion of the substrate planetary manipulator in AdNanoTek's E-beam system facilitates precise and simultaneous deposition of thin films on multiple substrates. This is achieved through the revolution and rotation motion of the manipulator, which significantly enhances the uniformity and quality of the thin films deposited.
AdNanoTek's FBBear system control software is designed to provide extensive control over the deposition process. It enables fine-tuning of parameters, comprehensive recording of the process, and the automatic setting of parameters, thereby streamlining and optimizing the entire deposition procedure.
The integration of the FBBear system control software in the deposition process results in a fully automated, user-friendly, and consistent operation, enhancing the efficiency and reliability of the procedure.
In the Electron Beam Evaporator (EBE), a high-energy electron beam is generated from a tungsten filament. This beam is then directed towards the target material using electric and magnetic fields, which focus the electrons to precisely heat the surface of the target.
In the Electron Beam Evaporator (EBE) system, the position of the electron beam can be visually confirmed. This allows for accurate verification that the electrons are bombarding the target material at the correct location, ensuring precision in the heating and evaporation process.
When the target material in the Electron Beam Evaporator (EBE) is heated, its vapor pressure increases, leading to the evaporation of surface atoms. These vaporized atoms then travel through the vacuum chamber and condense on the substrate, forming a thin-layer film. This process is key to the efficient and precise deposition of materials in thin film fabrication.
The E-beam Evaporator, despite being a type of thermal evaporation process, offers several advantages over traditional resistive thermal evaporation. It is available in two different configurations to cater to a variety of application needs.
10 inch Heater element, with 8 inch wafer
23cm Manipulator
Very Small Beam Spot

JEB-2 UHV

Include

JEB - ADV

This JEB-2 is 3 chambers design include a standard load lock chamber, UHV sputter deposition chamber and E-beam source under sputter chamber,  Sputter chamber include Oxidation and milling and sputter process.
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